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  august 2007 rev 1 1/17 17 TDA7570 250w pwm high efficiency power audio amplifier features output power 2 x 70w / 1 x 250w @ thd<1% pwm output 30v supply voltage (max) stand-by mute protections against short circuit across the load chip thermal protection external temperatur e sensor possibility thermal warning pins adjustable clip detector pin description the TDA7570 is a switchmode power audio amplifier with differential inputs and pwm output. the maximum output current and voltage swing are depending by the output circuitry (power supply, external power transistors and sensing resistors). the device can work as a stereo single-ended channels or a mono bridge power amplifier. hiquad64 table 1. device summary order code package packing TDA7570 hiquad64 tray www.st.com
contents TDA7570 2/17 contents 1 block and simplified applicatio n diagram . . . . . . . . . . . . . . . . . . . . . . . 3 2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.4 notes on the electrical schematic shown in figure 3 . . . . . . . . . . . . . . . . 11 3.4.1 main characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4 functions, pins and components descr iption . . . . . . . . . . . . . . . . . . . 12 4.1 components with critical placement and type: . . . . . . . . . . . . . . . . . . . . . 12 4.2 input capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.3 short circuit protection current calculation . . . . . . . . . . . . . . . . . . . . . . . . 12 4.4 external thermal protection network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.5 gate driving network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.6 external connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 package informations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
TDA7570 block and simplified application diagram 3/17 1 block and simplified application diagram figure 1. block and simplified application diagram 5v dig left channel signal processing term. clip ntc thwext thwint interface channel left hsd + protections output lowpass filter output lowpass filter channel left lsd + protections right channel signal processing interface channel right hsd + protections channel right lsd + protections 40 spi1 +25v out left out right -25v -25v d00au1198 +25v spi2 gpl gpls gnls gnl snl2 snl1 46 45 29 30 31 36 37 38 ref 2.5v mute st-by -2.5v 52 55 56 49 50 26,27,58,59 25 57 60 61 -v s -v s +v refl -v s +v refl sgnd dgnd -v s +v refl snr1 snr2 gnr gnrs gprs gpr spr2 spr1 -v s +5 +v s -5 54 cd cdsel2 cdsel1 5v dig feed l in +v s -v ref1 +v s +v s -l ow 13 42 12 9 28 14 18 17 22 21 23 24 8 7 4 5 63 64 62 in l+ in l- in r+ in r- pgnd osc 33 34 o0-15 i-ofclk 6 15 53 32 10
pin description TDA7570 4/17 2 pin description figure 2. pins connection diagram table 2. pins description pin number name function voltage limit (low) voltage limit (high) 1 n.c. not connected 2 n.c. not connected 3 n.c. not connected 4 gpr gate pmos, right channel +vs-12v 30v 5 gprs sense gate pmos, right channel +vs-12v 30v 6+vs-5 +vs-6 7 spr2 sensing 2 pmos, right channel 30v 8 spr1 sensing 1 pmos, right channel 30v 9 +vs-vref1 supply drivers pmos +vs-12v 30v 10 pgnd power ground 0 (ref.) 11 n.c. not connected 1 2 3 5 6 4 7 8 9 10 27 11 28 29 30 31 32 59 58 57 56 55 54 53 47 46 45 43 42 44 52 51 50 48 49 +vs-5 gprs gpr n.c. n.c. n.c. n.c. pgnd +vs-vref1 spr2 spr1 -vs -vs feed l in cdsel1 cdsel2 cd dgnd -vs -vs feed r in st-by mute +2.5v sgnd n.c. n.c. in l+ n.c. n.c. in l- -2.5v n.c. in r+ in r- ac00241 26 60 -vs+vrefr 61 snr1 62 snr2 63 gnrs 64 gnr gnl gnls snl2 snl1 -vs+vrefl 21 22 23 24 25 41 40 38 37 39 +vs-low n.c. ntc thwext n.c. 12 13 14 15 16 n.c. -vs+5 spl2 +vs spl1 36 34 33 35 thwint o0-i5 i-o-fclk n.c. 17 18 19 20 n.c. n.c. gpl gpls 5vdig
TDA7570 pin description 5/17 12 +vs positive power supply 30v 13 spl1 sensing 1 pmos, left channel 30v 14 spl2 sensing 2 pmos, left channel 30v 15 -vs+5 -vs+6 16 n.c. not connected 17 gpls sense gate pmos, left channel +vs-12v 30v 18 gpl gate pmos, left channel +vs-12v 30v 19 n.c. not connected 20 n.c. not connected 21 gnl gate nmos, left channel -30v -vs+12v 22 gnls gate nmos, left channel -30v -vs+12v 23 snl2 sensing 2 nmos, left channel -30v 24 snl1 sensing 1 nmos, left channel -30v 25 -vs+vrefl supply drivers nmos. left channel -30v -vs+12v 26 -vs negative power supply -30v 27 -vs negative power supply -30v 28 feed l in feedback network left channel -5v 5v 29 cdsel1 clip detector selection 1 5.5v 30 cd sel2 clip detector selection 2 5.5v 31 cd clip detector output 5.5v 32 dgnd digital ground 0 (ref) 33 i-o-fclk clock frequency input/output pin 5.5v 34 o0-i5 input/output fclk selection 0 = output; 1 = input 5.5v 35 n.c. not connected 36 thwint internal thermal warning output 5.5v 37 thwext external thermal warning output 5.5v 38 ntc sensing resistors network 5.5v 39 n.c. not connected 40 5vdig digital 5v supply output 5.5v 41 42 +vs-low positive voltage supply low power 30v 43 n.c. not connected 44 n.c. not connected table 2. pins description (continued) pin number name function voltage limit (low) voltage limit (high)
pin description TDA7570 6/17 45 in l- left channel negative input -3v 3v 46 in l+ left channel positive input -3v 3v 47 n.c. not connected 48 n.c. not connected 49 in r+ right channel positive input -3v 3v 50 in r- right channel negative input -3v 3v 51 n.c. not connected 52 -2.5v signal -2.5v supply output -2.75v 53 sgnd signal ground 0 (ref) 54 +2.5v signal 2.5v supply output 2.75v 55 mute mute input 5.5v 56 st-by stand by input 6v 57 feed r in feedback network right channel -5 5v 58 -vs negative voltage supply -30v 59 -vs negative voltage supply -30v 60 -vs+vrefr supply drivers nmos. right channel -30v -vs+12v 61 snr1 sensing 2 nmos, right channel -30v 62 snr2 sensing 1 nmos, right channel -30v 63 gnrs sense gate nmos, right channel -30v -vs+12v 64 gnr gate nmos, right channel -30v -vs+12v table 2. pins description (continued) pin number name function voltage limit (low) voltage limit (high)
TDA7570 electrical specifications 7/17 3 electrical specifications 3.1 absolute maximum ratings 3.2 thermal data 3.3 electrical characteristics table 3. absolute maximum ratings symbol parameter value unit v s operating supply voltage 30 v p tot power dissipation t case = 85c 21 w t j junction temperature, operating range -40 to 150 c t stg storage temperature, operating range -55 to 150 c table 4. thermal data symbol parameter value unit r th j-case thermal resistance ju nction to case 3 c/w table 5. electrical characteristics (v s = 25v, r l = 4 , f = 100hz, t j = 25c, gain = 28db, application circuit shown in figure 3 , 2x65/1x130w system, unless otherwise specified.) symbol parameter test condition min. typ. max. unit v s operating supply voltage 12 30 v i q quiescent supply current v st-by = 5v, f switching = 352.8khz from +v s from +v s -low from -v s 20 5.4 20 25 7 25 35 9 35 ma ma ma i st-by quiescent supply current v st-by = 0 from +v s 0.35 0.5 0.65 ma v st-by = 0 from -v s -0.2 -0.3 -0.4 ma v os output offset voltage output-gnd (single-ended) 350 mv output l - output r (bridge) 120 mv p o output power single-ended, @ thd = 1% 2 x 70w system 70 w bridge, @ thd = 1% 1 x 250w system 250 w p d power dissipation of the TDA7570 quiescent condition 1.5 1.75 w
electrical specifications TDA7570 8/17 p dt power dissipation of the external power transistors (total) @ p out = 25w, bridge configuration 10 w thd total harmonic distortion @ p out = 10 w, single ended 0.1 % @ p out = 40 w, bridge 0.03 0.1 % g gain single-ended 27 28 29 db g gain bridge 33 34 35 db e n output noise single_ended "a" weighted 200 v e output noise bridge "a" weighted 150 v g e delta gain error between channels f = 1khz, after output filter of tbd order, 20khz butterworth 0.5 db r i input resistance single-ended 7 10 13 k r i input resistance bridge 3.5 5 6.5 k v gspth threshold voltage of the pchannel v gs sensor (vspx1 - vgpxs) 2.533.5v v gsnth threshold voltage of the pchannel v gs sensor (vgnxs - vsnx1) 2.533.5v c t crosstalk f = 1khz, v o = 2vrms 50 60 db a m mute attenuation v o = 2vrms 70 80 db svr supply voltage rejection f = 100hz, v r = 0.5v 50 60 db f sw switching frequency 250 310 360 khz v il logic inputs low level voltage 1.5 v v ih logic inputs high level voltage 2.3 v clip detector vcd clip detector pin max operating voltage (open drain) 5.5 v cdl clip detector pin leakage current cd off 1 a cds clip detector pin saturation voltage cd on, 1ma 1 v cdi clip detector thd intervention cdsel1=0, cdsel2=0 (near clipping detection) 0.5 % cdsel1=0, cdsel2=1 1 % cdsel1=1, cdsel2=0 5 % cdsel1=1, cdsel2=1 8 % table 5. electrical characteristics (continued) (v s = 25v, r l = 4 , f = 100hz, t j = 25c, gain = 28db, application circuit shown in figure 3 , 2x65/1x130w system, unless otherwise specified.) symbol parameter test condition min. typ. max. unit
TDA7570 electrical specifications 9/17 protections t hwc chip thermal warning intervention 150 c t sdc thermal shut-down chip 160 c t sdch thermal shut-down chip hysteresis 10 c t hws external thermal warning intervention 5vdig x 0.45 5vdig x 0.48 5vdig x 0.51 v t sds external thermal shut-down intervention 5vdig x 0.37 5vdig x 0.4 5vdig x 0.43 v t sdsh external thermal shut-down hysteresis 5vdig x 0.03 7 5vdig x 0.04 5vdig x 0.043 v v pp protection intervention voltage pchannel (vspx1-vspx2) 85 100 120 mv v pn protection intervention voltage nchannel (vsnx2-vsnx1) 85 100 120 mv i spx1 current input pins 7, 13 150 200 260 a i snx1 current output pins 24, 61 -150 -200 -260 a drivers v hgp high level output voltage (gpl, gpr) +v s -10 v v lgp low level output voltage (gpl, gpr) +v s v v hgn high level output voltage (gnl, gnr) -v s v v lgn low level output voltage (gnl, gnr) -v s +10 v i hgp high level output sink current (gpl, gpr, peak) 2.2 a i lgp low level output source current (gpl, gpr, peak) 2.7 a i hgn high level output sink current (gnl, gnr, peak) 2.5 a i lgn low level output source current (gnl, gnr, peak) 1.7 a internal power supply 5vdig 5vdig pin output voltage r eference: dgnd pin 4.3 4.8 5.3 v 2.5v 2.5v pin output voltage reference: sgnd pin 2.15 2.4 2.65 v -2.5v -2.5v pin output voltage reference: sgnd pin -2.15 -2.4 -2.65 v vref1 vref1 pin output voltage r eference: + vs pin 8.6 9.6 10.6 v vrefl/vrefr vrefl, vrefr pin output voltage r eference: - vs pin -8.6 -9.6 -10.6 v table 5. electrical characteristics (continued) (v s = 25v, r l = 4 , f = 100hz, t j = 25c, gain = 28db, application circuit shown in figure 3 , 2x65/1x130w system, unless otherwise specified.) symbol parameter test condition min. typ. max. unit
electrical specifications TDA7570 10/17 figure 3. application diagrams
TDA7570 electrical specifications 11/17 3.4 notes on the electri cal schematic shown in figure 3 3.4.1 main characteristics 2 channels single-ended or 1 channel bridge pwm amplifier power output: see ta b l e 5 gain single-ended = 28 db gain bridge = 34db clip detector settled at thd=10% internal master oscillator the schematic is depicted showing the suggested structure of the printed circuit board tracks (star points, high current path, components placement). to avoid malfunctioning due to the parasitic inductance, short connections lengths are recommended. table 6. component characteristics component (see schematic of figure 4 ) minimum load: 2 x 4 ohm single-ended or 8 ohm bridge (2 x 65w / 1 x 130w) minimum load: 2 x 2 ohm single-ended or 4ohm bridge (2 x 125w / 1 x 250w)) p-mos-l p-mos-r stp12pf06 2 x stp12pf06 in parallel n-mos-l n-mos-r stp14nf06 2 x stp14nf06 in parallel rp-n-l2 rp-p-l2 rp-n-r2 rp-p-r2 not present 4.7k
functions, pins and components description TDA7570 12/17 4 functions, pins and components description 4.1 components with critical placement and type: ci-l1, ci-l2, ci-r1, ci-r2 must be placed as near as possible to the sources of the respective power mos. if 2 power mos in parallel are needed, can be useful to place a couple of capacitors for each couple of power mos. these capacitors are needed to absorb the high di/dt current present during the pchannel/nchannel and nchannel/pchannel transition that can cause high peak voltages on the power supply wiring connection due to their parasitic inductance. the capacitors placed between +vs to gnd and to -vs are distributed along the power lines. with p.c. board with very short connections, some of these capacitors can be avoided (cvs-1, cvs-2, cd3, cd4, cd5, cd6). the current sensing resistors rsens-n-l, rsens-p-l, rsens-p-r and rsens-n-r must be not inductive components, as example, made by a costant an wire. 4.2 input capacitors the value of the input capacitors (cin-l+, cin-l-, cin-r+, cin-r- depends on the desired -3db high pass cutoff frequency, following the formula: 4.3 short circuit protection current calculation figure 4. short circuit protection current diagram (example for the n-channel) if rp2 is not used f3db () 1 6.28 10000 c in ?? --------------------------------------------- - = cfil (typ 2.2nf) to -vs rsens (not inductive resistor) typ. values = 10 ? 30 mohm rfil (typ. 100 ohm) rp1 (typ=4.7kohm) rp2 vfil = ispx1 x rfil = 20mv typ spx1 pin spx2 pin TDA7570 vp=100mv typ comparator imos i lim 1 rsens ----------------- - vpx rp1 rp2 + () ? rp2 ------------------------------------------------- - vfil + ?? ?? = i lim 1 rsens ----------------- - vpx vfil + () =
TDA7570 functions, pins and components description 13/17 4.4 external thermal protection network example of external thermal protection circuitry components: ? type: b57621 c621/100k/+ ?r text = 10k results (simulations): ? external thermal warning temperature intervention: 90 c ? external thermal shut down temperature intervention: 100 c ? external thermal shut down hysteresis: 6 c 4.5 gate driving network the main purpose of the 27 ohm resistors rd-n-l, rd-p-l, rd-n-r and rd-p-r are the following: 1) dumping of the l-c equivalent circuit done by the parasitic inductance and capacitance present in the circuit 2) reduction of the dv/dt of the vgs and then reduction of the di/dt of the drain current of the power mos. the r-c snubber network done by: ? rs-n-l, cs-n-l ?rs-p-l, cs-p-l ? rs-n-r, cs-n-r ? rs-p-r, cs-p-r are in the direction to increase the dumping (point 1) and reduce the dv/dt (point 2. the value of these components is also depending on the layout structure. with a reduction of the parasitic inductance present in the p.c. board layout, in the region around the power transistors, the value of these components can be reduced, giving advantage in terms of thd, mainly at mid-high power levels, due to the reduction of the "dead zone". the minimum suggested value of rd-x-x is around 10 , while, is some cases, rs-x-x and cs-x-x can be removed. 4.6 external connections cd, thwext, thwint these pins, if used, it must be connected to a pull-up resistor (>10k ) connected to a supply voltage referred to the receiver device (as example, a p). max 10v. mute - to have a soft mute-play and play-mute transition, an r-c network can be applied (as example 47k , 1 f) st-by - to avoid pop noise due to multiple st-by parasitic pulses, an r-c network can be added (as example 47k , 0.1 f) +v s -low - this pin supply the low voltage circui ts. it can be connected to the +vs or to a reference voltage comprising between 12v to +vs.
functions, pins and components description TDA7570 14/17 a connection to +vs through a 100 resistor, together a 1 f capacitor placed from +vs-low and gnd is possible too. nl+, inl-, inr+, inr- input pins. the sign is referred to the input of the differential-to- singleended amplifier. because the power stage is an inverting stage, the output of the amplifier is with opposite sign with respect these pins. for bridge operation, the connection inl+ must be shorted to the inr- and the connection inl- must be shorted to inr+
TDA7570 package informations 15/17 5 package informations in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. figure 5. hiquad-64 mechanical data and package dimensions hiquad-64 dim. mm inch min. typ. max. min. typ. max. a 3.15 0.124 a1 0 0.25 0 0.010 a2 2.50 2.90 0.10 0.114 a3 0 0.10 0 0.004 b 0.22 0.38 0.008 0.015 c 0.23 0.32 0.009 0.012 d 17.00 17.40 0.669 0.685 d1 (1) 13.90 14.00 14.10 0.547 0.551 0.555 d2 2.65 2.80 2.95 0.104 0.110 0.116 e 17.00 17.40 0.669 0.685 e1 (1) 13.90 14.00 14.10 0.547 0.551 0.555 e 0.65 0.025 e2 2.35 2.65 0.092 0.104 e3 9.30 9.50 9.70 0.366 0.374 0.382 e4 13.30 13.50 13.70 0.523 0.531 0.539 f 0.10 0.004 g 0.12 0.005 l 0.80 1.10 0.031 0.043 n10 (max.) s 0 (min.), 7?(max.) (1): "d1" and "e1" do not include mold flash or protusions - mold flash or protusions shall not exceed 0.15mm(0.006inch) per side c a a2 poqu64me e4 (slug lenght) 1 64 e1 gauge plane 0.35 l slug (bottom side) coplanarity g e b a n f ab m e3 21 33 53 b e2 d1 d e bottom view c a3 c seating plane s a1 e3 d2 (slug tail width) outline and mechanical data
revision history TDA7570 16/17 6 revision history table 7. document revision history date revision changes 29-aug-2007 1 initial release.
TDA7570 17/17 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2007 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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